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High Efficiency NXV560T at IMTS 2018

  Highlights of NXV560T
  • Semiconductor | Micro Machining | Ceramic & Glass | Aerospace | Hard & Brittle Materials
  • Ultimate body structure through fem analysis.
  • Ball type linear guideways applied on the three axes.
  • All 3 axes with direct drive design and absolute position encoders.
  • High speed dual-contact big-plug built-in spindle.
  • Absolute encoder atc system.
  • High efficient chip removal system.
  • Ultrasonic tool holder 18,000rpm (opt.).

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