YCM will join Bay Union Abrasive Technology at SEMICON Taiwan 2026, one of the semiconductor industry's key platforms for connecting companies and professionals across advanced manufacturing, equipment, materials, and smart manufacturing technologies.

This year's showcase will focus on precision semiconductor components and hard & brittle material machining, combining YCM’s precision machining and integration capabilities with Bay Union's expertise in grinding wheels and grinding applications. Featured applications cover a range of materials, including metals, quartz, ceramics, and silicon carbide.

Event: SEMICON Taiwan 2026
Date: September 2–4, 2026
Time: 10:00 AM–5:00 PM
Venue: Taipei Nangang Exhibition Center, Hall 2, 4F
Booth: R8206
Official Website: https://www.semicontaiwan.org/en 

Visit YCM and Bay Union at Booth R8206 to discuss your parts and machining requirements and explore solutions for higher-quality, more efficient semiconductor manufacturing.